Accurate, Precise, Scalable Metrology

Quantitative Structure & Composition Analytics
for Materials GenAI

Technology

Know your data, choose your future.

More images and more data mean faster & better insights. You've invested years collecting SEM-TEM EDS data, with millions of images, and trillions of features. Extract actionable insights from your existing structure and composition data to drive performance, improve reliability, increase yields, and accelerate product innovation.

■ Custom Segmentation

Combine custom and human-driven ML segmentation along with spectral processing to analyze the elemental composition of every structure in every image.

■ Quantification

Advanced algorithms reveal every pixel: precise identification and location with 50-100X higher resolution than traditional methods.

• Every pixel, feature, and image

• 10, 10K, or 10M+ images

■ Curation

Guaranteed pixel-level traceability and provenance of image and processing parameters ensure your data can be accessed and leveraged as needed.

■ Scorecards

Quantitative Scorecards deliver clarity and control:

• Compare processes, materials, and machines

• Reveal hidden patterns and variations

• Workforce skills development

• Track performance trends over time

• Empower teams with actionable intelligence

■ Insights

Unlock existing materials data for:

• Performance benchmarking across operations.

• Root cause analysis

• In-line & predictive quality control

• Innovation acceleration with data

• Intelligent automated continuous improvement

■ Statistical Analytics

Accurate and precise, statistically valid data with the highest confidence (lowest p-value) for:

• Technology development

• Manufacturing processes

• Failure Analysis

■ Materials GenAI

Transform image and process data into nano-scale materials intelligence powering GenAI to predict performance, improve yields and reliability, reduce costs, and accelerate new product development.

AI-ready, optimized data formats for:

• Large Language Model (LLM) training

• Retrieval-augmented generation (RAG)

• Materials AI Agents

Vision

Curiosity - The foundation of
discovery and innovation.

Curiosity drives us to ask questions that others overlook. To peek behind curtains that seem firmly closed. To imagine possibilities that don't yet exist. It's the spark that ignites every breakthrough. As Einstein observed,
"I have no special talents. I am only passionately curious." It's a reminder that wonder, not genius alone, propels us toward discovery and problem-solving. When we nurture our natural curiosity, we transform the unknown into an invitation to explore and create the conditions for innovation to flourish.

Image Data harnesses the spirit of curiosity with technology that bridges multiple disciplines. With advanced microscopy, mathematics, material science, and machine learning, we help you create comprehensive databases of your materials' structure and composition data. By transforming raw data into structured, "Materials GenAI-ready" insights, we enable organizations to drive performance, improve reliability, increase yields, and accelerate product innovation in ways that were previously impossible. Our data architecture is purpose-built to solve tough problems today, and fuel the next generation of AI capabilities, from Large Language Model training to retrieval-augmented generation and intelligent Materials AI Agents.

Image Data Quantitative Scorecards transform your data into accurate and precise, actionable intelligence, providing clear metrics to compare people, processes, materials, and machines. These scorecards reveal patterns and variations in your data that might otherwise remain hidden, empowering teams to solve problems and drive innovation with precision and confidence. When integrated with Materials GenAI workflows, these scorecards become even more powerful—enabling AI agents to reason across your materials data and deliver insights at unprecedented speed and scale.

By uniting curiosity, cutting-edge technology, and decades of hands-on experience, Image Data transforms how your organization understands and optimizes its data, materials, and processes. The result is a powerful platform that turns questions into answers, challenges into opportunities, and data into a competitive advantage—today through human insight, and tomorrow through the transformative potential of Materials GenAI.

Acquire • Analyze • Curate • Learn • Change

Industries

Metals & Mining

Ore Mineralogy & Grade Mapping
• Identification of REE-bearing phases, sulfides, oxides, and silicates.
• Elemental quantification of Mo, Cu, Ni, Co for ore beneficiation modeling.

Inclusion Identification in Steel & Alloys
• Oxide/sulfide/oxy-sulfide inclusion morphology and size distribution.
• Inclusion–matrix interfacial chemistry affecting fatigue and toughness.

Corrosion Mechanism Analysis
• Pitting nucleation sites, intergranular attack progression, and chloride ingress pathways.
• Sulfur-rich corrosion product mapping in sour-service steels.

Mining Equipment Wear & Fatigue Analysis
• Wear particle morphology, microploughing evidence, and carbide pull-out.
• Crack initiation in high-strength steels used in drills and crushers.

Metallurgical Process Optimization
• Slag phase crystallinity, inclusion flotation behavior, and deoxidation efficiency.
• Grain structure refinement and secondary phase development in cast products.

Batteries

Cathode/Anode Degradation Mechanisms
• NMC/NCA particle cracking, Ni-rich phase segregation, oxygen release pathways.
• SEI thickness evolution, organic/inorganic SEI component distribution.

Lithium Dendrite Nucleation & Growth
• Dendrite tip morphology, branching behavior, and separator penetration mapping.
• Solid electrolyte interface fracture signatures during dendrite intrusion.

Solid-State Electrolyte & Interface Chemistry
• Grain-boundary transport pathways in LLZO/LLTO electrolytes.
• Interfacial decomposition phases (Li2CO3, LiOH) between ceramic/polymer boundaries.

Post-Cycling Failure Mechanisms
• Binder migration, conductive-carbon network collapse, pore clogging.
Gas-evolution residue chemistry (CO₂, O₂ breakdown-induced salts).

Contamination & Impurity Mapping
• Fe, Cu, and Ni particulate tracking from current collector corrosion.
• Transition-metal dissolution gradients across aged cathodes.

Quantum Materials & Devices

Superconducting Film Microstructure & Coherence-Limiting Defects
• Grain-boundary weak links, voids, roughness-induced scattering in Nb, NbTiN, and Al films.
• Oxide-layer integrity evaluation for Al/AlOx/Al Josephson junctions.
• Nanostructural origins of TLS (two-level system) defects impacting qubit T₁/T₂.

Josephson Junction Barrier Uniformity & Interface Chemistry
• Å-level measurement of AlOx barrier thickness uniformity.
• Contaminant segregation (C, O, H, Cl) at the superconductor–insulator interfaces.
• Crystalline vs amorphous boundary classification affecting junction leakage.

Ion-Trap Electrode Surface Studies
• Field-emission hotspots associated with particulates, micro-protrusions, or sputter damage.
• Elemental signatures of surface contamination driving anomalous motional heating.

Photonic & Silicon Spin-Qubit Nanostructures
• Waveguide defect scattering centers, interface roughness, and phase error sources.
• Stoichiometry mapping of nonlinear optical materials (LN, SiN, GaAs).

Cryogenic Reliability & Phase Stability Studies
• Low-temperature crack propagation, phase transitions, and thermal cycling microstructural drift.
• Hydrogen adsorption effects on superconducting surface roughness and loss mechanisms.

Medical Devices

Implant Surface Engineering & Coating Quality
• Ti/TiO₂/HA coating morphology, porosity, crystallinity, and adhesion integrity.
• Nano-topography measurement for osseointegration enhancement.

Corrosion & Ion Release Failure Analysis
• Localized corrosion pits in CoCr, Ti, and stainless implants.
• Elemental mapping of Ni, Cr, and Mo release pathways causing adverse tissue reactions.

Additively Manufactured Implant Evaluation
• Lattice-structure porosity gradients, microstructural anisotropy, and fatigue initiation sites.
• Powder-bed contamination and partially melted particle incorporation.

Polymer-Based Device Degradation
• Oxidation, crazing, and leaching of additives/plasticizers.
• Chemical mapping of degraded polymer chains in catheters and housings.

Contamination Control & Cleanliness Validation
• Foreign particulate identification (Ti, Si, Al, C) for FDA validation.
• Characterization of machining residue, passivation failures, and sterilization-induced chemistry changes.

Aviation

Hot-Section Superalloy Failure Mechanisms
• Creep cavitation, γ′ rafting directionality, TCP phase formation (σ, μ, Laves), and residual casting porosity.
• Thermally induced interdiffusion zones, oxidation-layer stratification, and bond-coat–substrate Al depletion.
• Mapping corrosive species (Na, S, Cl, V) associated with Type I/II hot corrosion.

TBC (Thermal Barrier Coating) Health & Bond-Line Degradation
• TGO phase analysis: transient oxides vs stable α-Al₂O₃ identification.
• CMAS glassy-phase infiltration depth and crystallization signature mapping.
• Inter-splat cracking, porosity gradients, and bond-coat creep damage.

Fractography of Airframe Structural Alloys
• Fatigue striations, river patterns, intergranular vs transgranular cleavage transitions.
• S-phase dissolution and re-precipitation behavior in 2XXX/7XXX aluminum.
• Hydrogen-induced decohesion in Ti-6Al-4V and microvoid coalescence mapping.

Composite Structure Damage & FOD Identification
• Fiber–matrix interphase analysis, fiber pull-out, resin smear, and hackle marks.
• Radome or nacelle impact signature differentiation (hail vs bird vs runway FOD) based on residue chemistry.
• Nano-void content, crushed plies, and shock-induced resin crystallinity shifts.

Additive Manufacturing Process Qualification
• Keyhole porosity, LOF (lack of fusion), spatter-induced inclusions, and melt-pool boundary defects.
• Powder reuse contamination (O, N, H, Fe, Cr) and recoater wear debris identification.
• Phase transformation and precipitation mapping (γ″, δ, α-case) in LPBF Ti and IN718.

Semiconductors

Advanced Failure Analysis
• Nanoscale mapping of killer defects such as bridging, voiding, micro-void collapse, and contact/via silicide failures.
• Localization of trace contamination (Cl, F, Cu, W, K, Na) responsible for dielectric breakdown, BTI drift, and leakage.

Advanced Interconnects & BEOL Reliability Analysis
• Morphology and roughness analysis of Cu/Co barriers and Ru liners at sub-10nm dimensions.
• Detection of early-stage electromigration voids, bamboo grain structures, and interfacial delamination.
• Characterization of low-k dielectric collapse, trench fill defects, and plasma-damage-induced carbon depletion.

2.5D/3D Packaging and TSV/TGV Analysis
• Voiding, intermetallic formation, and IMC progression in microbumps and hybrid bonding interfaces.
• Copper pumping and thermo-mechanical fatigue mapping in advanced packaging stacks.
• TSV sidewall defects, barrier-layer breaches, and dielectric delamination.

University Engagement

Ceramics & Functional Oxides

Sub-Areas

Ferroelectrics & Piezoelectrics
Thermal Barrier Coatings (TBCs)
Solid Oxide Fuel Cells (SOFCs)
Transparent Conductive Oxides (TCOs)

Technical Details

TEM diffraction for domain orientation in ferroelectrics (PZT, HfO₂).
EDS for dopant distribution in YSZ coatings.
Raman for oxygen vacancy dynamics.
XRD for crystal phase transitions and stress mapping.

Commercial Relevance

Memory devices (FeRAM, HfO₂-based FeFET).
Jet engine thermal coatings.
Hydrogen/e-fuel SOFC systems.
Touchscreens, displays, photovoltaics.

Polymers, Soft Materials & Biomaterials

Sub-Areas

Structural Polymers & Composites
Biopolymers & Tissue Scaffolds
Polymer Aging, UV/Oxidation
Membranes & Filtration Media

Technical Details

SEM for fiber fracture surfaces and microvoid evolution.
AFM for viscoelastic mapping and polymer nanomechanics.
FTIR/Raman for bond-breaking, oxidation states, curing kinetics.
TEM for nanoparticle dispersion in composites.

Commercial Relevance

Aerospace composites (carbon fiber, epoxy).
Medical implants & drug-delivery systems.
Filtration (PFAS removal, desalination).
Packaging, automotive interiors.

Battery & Electrochemical Energy Storage

Sub-Areas

Li-Ion Cathode/Anode Degradation
Solid-State Electrolytes
SEI/CEI Interface Chemistry
High-Voltage/High-Ni Cathode Stabilization

Technical Details

TEM/STEM analysis of Ni-rich NMC particle cracking, cation mixing, and oxygen loss.
XPS/SIMS for SEI composition, LiF formation, and interphase depth profiling.
In-situ TEM for observing dendrite nucleation in solid electrolytes.
Raman/IR for detecting phase transitions and electrolyte decomposition.

Commercial Relevance

EV pack lifetime extension.
Fast-charging optimization.
Solid-state EV batteries.
Consumer electronics energy density boosts.

Quantum Materials & Devices

Sub-Areas

Superconductors (NbTiN, YBCO, REBCO)
2D Materials (MoS₂, WS₂, graphene)
Topological Materials & Spintronics
Quantum Dots & Single-Photon Emitters

Technical Details

STEM/EELS for mapping oxygen stoichiometry in cuprates and nickelates.
SEM/AFM for grain-boundary control in superconducting thin films.
Raman for heterostructure layer alignment and strain mapping in 2D stacks.
Cathodoluminescence for defect-bound excitons in color centers (NV, SiV).

Commercial Relevance

Quantum computers (superconducting qubits, spin qubits).
Quantum-sensing and photonic devices.
Next-generation 2D-material transistors.

Photovoltaics & Optoelectronics

Sub-Areas

Perovskite Stability & Ion Migration
III–V Multijunction Cells
Silicon Heterojunction Interfaces
LED & Laser Diode Defect Physics

Technical Details

TEM for observing perovskite grain boundaries and PbI₂ secondary phases.
CL/SAM for defect-related nonradiative recombination.
XPS for interface band alignment and Fermi-level pinning.
SIMS for dopant/impurity diffusion in III–V stacks.

Commercial Relevance

Utility-scale solar panels (high-efficiency perovskites).
Space-grade multijunction cells.
MicroLED displays.
High-brightness VCSELs.

Metals, Alloys, and Additive Manufacturing

Sub-Areas

High-Entropy Alloys (HEAs)
Aerospace Superalloys (Ni-based)
Additive Manufacturing Defects
Hydrogen Embrittlement

Technical Details

TEM diffraction for phase identification in HEAs.
EBSD/EDS for grain orientation, segregation, and recrystallization mapping.
SEM for porosity, lack-of-fusion defects, and melt-pool morphology.
Atom probe tomography for analyzing hydrogen trapping sites.

Commercial Relevance

Jet engine turbine blades.
High-strength lightweight structures.
Additive-manufactured metal parts for aerospace & medical.
Hydrogen economy infrastructure.

Corrosion Science & Surface Engineering

Sub-Areas

Passivation Layer Failure
High-Temperature Oxidation
Coatings & Surface Treatments
Marine & Harsh-Environment Corrosion

Technical Details

SEM/EDS for pitting and intergranular corrosion.
XPS for chemical state analysis of oxide layers.
SIMS for chloride ingress profiling.
AFM for nanoscale surface roughness changes over time.

Commercial Relevance

Oil & gas infrastructure.
Marine vessels.
Aerospace alloys.
Industrial coatings (TiN, DLC).

Geological & Earth Materials

Sub-Areas

Mineralogy & Ore Formation
Microfossils & Paleomagnetism
Hydrated Minerals & Clays
Planetary Materials (meteorites, lunar regolith)

Technical Details

SEM/TEM for microtexture and mineral inclusions.
Raman/FTIR for mineral phase identification.
Electron microprobe for trace-element mapping.
Isotope analysis for geochronology.

Commercial Relevance

Mining & rare-earth extraction (lithium, cobalt).
Carbon sequestration.
Planetary exploration & space mining.

Catalysts & Chemical Engineering Materials

Sub-Areas

Heterogeneous Catalysts (Pt, Ni, Co)
Zeolites & Porous Materials
MOFs & CO₂ Capture Materials
Thermochemical Catalysts

Technical Details

TEM for nanoparticle size distribution on catalyst supports.
XPS for oxidation states under operando conditions.
In-situ Raman for reaction intermediates.
BET for porosity & surface area.

Commercial Relevance

Chemical plants & refinery catalysts.
Green hydrogen production.
Carbon capture & conversion.
Polymer production catalysts.

Semiconductor Materials & Devices

Sub-Areas

Defect Engineering & Failure Analysis
Thin-Film Metrology & Interface Physics
Advanced Lithography & Pattern Transfer
Epitaxy & Crystal Growth

Technical Details

STEM/TEM used for nanoscale defect mapping (stacking faults, dislocations, voids).
EDS/EELS for atomic-scale chemical segregation at interfaces (e.g., Si/SiGe, metal/high-k).
SEM/AFM to measure line-edge roughness, CD variation, and sidewall angles.
SIMS and XPS for doping profiles and contamination analysis.

Commercial Relevance

Logic and memory node scaling (7 nm → 1 nm).
Yield enhancement & defectivity control for fabs.
EUV patterning research.
Advanced packaging (3D-IC, hybrid bonding).

CONTACT

Accurate, Precise, Scalable Metrology

Technology

Know your data, choose your future.

■ Custom Segmentation

■ Quantification

■ Curation

■ Scorecards

■ Insights

■ Statistical Analytics

■ Materials GenAI

Curiosity - The foundation of
discovery and innovation.

Acquire • Analyze • Curate • Learn • Change

Industries

University Engagement

CONTACT US

We'd love to hear from you.

Accurate, Precise, Scalable Metrology

Technology

Know your data, choose your future.

■ Custom Segmentation

■ Quantification

■ Curation

■ Scorecards

■ Insights

■ Statistical Analytics

■ Materials GenAI

Curiosity - The foundation of discovery and innovation.

Acquire • Analyze • Curate • Learn • Change

Industries

University Engagement

CONTACT US

We'd love to hear from you.

Curiosity - The foundation of
discovery and innovation.