Industries

Structure and composition insight across the fields that move materials forward.

Advanced Failure Analysis

  • Nanoscale mapping of killer defects such as bridging, voiding, micro-void collapse, and contact/via silicide failures.
  • Localization of trace contamination (Cl, F, Cu, W, K, Na) responsible for dielectric breakdown, BTI drift, and leakage.

Advanced Interconnects & BEOL Reliability Analysis

  • Morphology and roughness analysis of Cu/Co barriers and Ru liners at sub-10nm dimensions.
  • Detection of early-stage electromigration voids, bamboo grain structures, and interfacial delamination.
  • Characterization of low-k dielectric collapse, trench fill defects, and plasma-damage-induced carbon depletion.

2.5D/3D Packaging and TSV/TGV Analysis

  • Voiding, intermetallic formation, and IMC progression in microbumps and hybrid bonding interfaces.
  • Copper pumping and thermo-mechanical fatigue mapping in advanced packaging stacks.
  • TSV sidewall defects, barrier-layer breaches, and dielectric delamination.