Universities
Partnering with researchers across ten materials-science and device disciplines.
Sub-Areas
- Defect Engineering & Failure Analysis
- Thin-Film Metrology & Interface Physics
- Advanced Lithography & Pattern Transfer
- Epitaxy & Crystal Growth
Technical Details
- STEM/TEM used for nanoscale defect mapping (stacking faults, dislocations, voids).
- EDS/EELS for atomic-scale chemical segregation at interfaces (e.g., Si/SiGe, metal/high-k).
- SEM/AFM to measure line-edge roughness, CD variation, and sidewall angles.
- SIMS and XPS for doping profiles and contamination analysis.
Commercial Relevance
- Logic and memory node scaling (7 nm → 1 nm).
- Yield enhancement & defectivity control for fabs.
- EUV patterning research.
- Advanced packaging (3D-IC, hybrid bonding).